Memory rather than the main compute engine
SK hynix manufactures memory, including DRAM and NAND products. Its high-bandwidth-memory technology stacks DRAM dies and connects them through vertical interfaces. Packaging and thermal control help that memory operate alongside accelerators; supplying it does not establish authorship of every model trained on the resulting system. [1]
Production and development have different evidence
The company’s September 2024 account reported the start of 12-layer HBM3E mass production, while customer supply remained a subsequent step. Its June 2026 NVIDIA agreement covered next-generation memory and supply, alongside simulation and fab-engineering tools. Those are specific technology roles rather than a general AI endorsement. [1][2]
Stargate intentions are not realized supply
The October 2025 Stargate record concerns memory-supply intentions and projected DRAM wafer demand. The signed LOI and MOU did not establish finished factories, guaranteed orders for all projected capacity or completed delivery of 900,000 packaged chips a month. [4][3]
Sources
- SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E
SK hynix · Sep 26, 2024
- NVIDIA and SK hynix Announce Multiyear Technology Partnership to Advance Memory for AI Factories
NVIDIA · Jun 7, 2026
- Samsung and SK join OpenAI’s Stargate initiative to advance global AI infrastructure
OpenAI · Oct 1, 2025
- SK Group Partners with OpenAI to Advance Global AI Infrastructure
SK · Oct 1, 2025